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Chip scale package (CSP)
John H. Lau, Ricky S.W. Lee, Ricky S. Lee · McGraw-Hill Professional
564 sayfa · 1999
Chip scale packaging / Integrated circuits / Microelectronic packaging / Design and construction
The Mechanics of solder alloy interconnects
D. R. Frear, Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau · Van Nostrand Reinhold
418 sayfa · 1993
Solder and soldering
Productivity of Jurong firms in 1973 & its comparative analysis between 1972-1973
S. H. Lau · National Productivity Board, Research Unit
61 sayfa · 1975
Economic conditions / Industrial districts / Industrial productivity / Industries